Low cost, high thermal performance package for flip chips with l

Details Low cost, high thermal performance package for flip chips with l Low cost, high thermal performance package for flip chips with l

1995-03-31

1997-04-15

Thompson, Gregory D.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

165 804, 174 163, 257707, 257713, 257719, 361715, 361718, H05K 720

Patent

active

056216157

ABSTRACT:
The flip chip package described is comprised of a substrate, a ring structure attached to the substrate, a heat removal structure, and a chip thermally coupled to the heat removal structure. The package lid is comprised of a ring structure and a heat removal structure. The ring structure and heat removal structure are separated until after attachment of the ring structure to the substrate allowing the ring structure to be brazed to the substrate. Brazing the ring structure to the substrate decreases the mechanical stress to the chip. A die attach material, between the first major surface of the die and the first major surface of the heat removal structure, adheres the die to and thermally couples the die to the heat removal structure. The die attach layer is of a predetermined thickness and thus provides a determined low thermal resistance making the thermal performance of the package certain.

REFERENCES:
patent: 4561011 (1985-12-01), Kohara et al.
patent: 4649990 (1987-03-01), Kurihara et al.
patent: 4658334 (1987-04-01), McSparran et al.
patent: 5089936 (1992-02-01), Kojima et al.

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