Low cost high density rectifier matrix memory

Static information storage and retrieval – Read only systems – Resistive

Reexamination Certificate

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Details

C365S051000, C365S230060

Reexamination Certificate

active

06956757

ABSTRACT:
A high density memory device is fabricated three dimensionally in layers. To keep points of failure low, address decoding circuits are included within each layer so that, in addition to power and data lines, only the address signal lines need be interconnected between the layers.

REFERENCES:
patent: 4442507 (1984-04-01), Roesner
patent: 5051865 (1991-09-01), Kato

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