Semiconductor device manufacturing: process – Making device or circuit responsive to nonelectrical signal – Thermally responsive
Reexamination Certificate
2005-09-27
2005-09-27
Tsai, H. Jey (Department: 2812)
Semiconductor device manufacturing: process
Making device or circuit responsive to nonelectrical signal
Thermally responsive
C438S121000, C438S124000
Reexamination Certificate
active
06949398
ABSTRACT:
A method is disclosed for encapsulating micromechanical elements or features on a substrate. In accordance with the method, a first substrate (111) is provided which has a patterned surface (113). A seed metallization (121) is then deposited onto the patterned surface, and a structural material layer (123), which preferably comprises copper, is electroplated onto the seed metallization. A solder (125), such as SnCu, is electroplated onto the metal layer, and the seed metallization, the structural material layer and the solder are removed from the first substrate as a cohesive structure (127), through the application of heat or by other suitable means, such that a negative replica of the patterned surface is imparted to the structure. The structure may then be placed on a second substrate (129) such that the solder is in contact with the second substrate, after which the solder is reflowed. Prior to reflow, the solder may be exposed to a fluorinated plasma, which forms a dry flux on the solder surface in the form of fluorinated metal oxides.
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Fay Owen
Lytle William H.
Markgraf Steven
Springer Stephen B.
Fortkort John A.
Fortkort Grether & Kelton LLP
Freescale Semiconductor Inc.
Tsai H. Jey
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