Low cost fabrication and assembly of lid for semiconductor...

Semiconductor device manufacturing: process – Making device or circuit responsive to nonelectrical signal – Thermally responsive

Reexamination Certificate

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C438S121000, C438S124000

Reexamination Certificate

active

06949398

ABSTRACT:
A method is disclosed for encapsulating micromechanical elements or features on a substrate. In accordance with the method, a first substrate (111) is provided which has a patterned surface (113). A seed metallization (121) is then deposited onto the patterned surface, and a structural material layer (123), which preferably comprises copper, is electroplated onto the seed metallization. A solder (125), such as SnCu, is electroplated onto the metal layer, and the seed metallization, the structural material layer and the solder are removed from the first substrate as a cohesive structure (127), through the application of heat or by other suitable means, such that a negative replica of the patterned surface is imparted to the structure. The structure may then be placed on a second substrate (129) such that the solder is in contact with the second substrate, after which the solder is reflowed. Prior to reflow, the solder may be exposed to a fluorinated plasma, which forms a dry flux on the solder surface in the form of fluorinated metal oxides.

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Michael B. Cohn, et al., “Microassembly Technologies for MEMS,” University of California at BerkeleyUniversity of Washington, 15 pages, date unknown.
Carl Blake, et al., “High Current Voltage Regulator Module Employs Novel Packaging Technology to Achieve Over 100A in a Compact Footprint to Power Next Generation Servers,” International Rectifier, 6 pages, presented at PCIM Europe 2002.
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