Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Reissue Patent
2011-07-12
2011-07-12
Zarneke, David A (Department: 2891)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
C438S107000, C438S110000, C438S112000, C438S121000, C438S122000, C438S113000, C438S611000, C438S612000, C438S613000, C174S254000, C174S260000, C361S749000
Reissue Patent
active
RE042542
ABSTRACT:
An electronic device and coupled flexible circuit board and method of manufacturing. The electronic device is coupled to the flexible circuit board by a plurality of Z-interconnections. The electronic device includes a substrate with electronic components coupled to it. The substrate also has a plurality of device electrical contacts coupled to its back surface that are electrically coupled to the electronic components. The flexible circuit board includes a flexible substrate having a front surface and a back surface and a plurality of circuit board electrical contacts coupled to the front surface of the flexible substrate. The plurality of circuit board electrical contacts correspond to plurality of device electrical contacts. Each Z-interconnection is electrically and mechanically coupled to one device electrical contact and a corresponding circuit board electrical contact.
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Transpacific Infinity, LLC
Wagner Jenny L
Zarneke David A
LandOfFree
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