Low boiling point liquid coolant cooling structure for electroni

Details Low boiling point liquid coolant cooling structure for electroni Low boiling point liquid coolant cooling structure for electroni

1995-03-01

1996-02-13

Crane, Sara W.

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With provision for cooling the housing or its contents

257714, 361689, 361700, 165 804, H05K 720, H01L 2334, F28F 700

Patent

active

054913632

ABSTRACT:
A cooling structure which is used for forced cooling of an electronic circuit package such as an integrated circuit is disclosed. The cooling structure comprises a tubular fin member having many through-holes of small diameter, a flat plate member which is joined to and seals one end of the tubular fin member, a lid member attached to the other end of the tubular fin member and a pipe member used as a nozzle from which coolant is jetted towards the plate member. Both the tubular fin member and the plate member are made of a material having high heat conductivity. The pipe member extends through the lid member or is inserted through an opening formed in the lid member. The electronic circuit package is fixed to the plate member.

REFERENCES:
patent: 3649738 (1972-03-01), Anderson et al.
patent: 4392007 (1983-07-01), Barkats et al.
patent: 4866570 (1989-09-01), Porter
patent: 4896247 (1990-01-01), Cozer
patent: 4977444 (1990-12-01), Nakajima et al.
patent: 5021924 (1991-06-01), Kieda et al.
IBM Technical Disclosure Bulletin, vol. 32, No. 8A, Jan. 1990, New York, pp. 168-170.

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