Chemistry: electrical and wave energy – Processes and products – Coating – forming or etching by sputtering
Reexamination Certificate
2005-03-01
2005-03-01
McDonald, Rodney G. (Department: 1753)
Chemistry: electrical and wave energy
Processes and products
Coating, forming or etching by sputtering
C204S192220, C204S192270, C204S192280, C204S192290, C204S192150
Reexamination Certificate
active
06860974
ABSTRACT:
There are provided techniques of forming a back reflecting layer with constant characteristics throughout long-term film formation and forming a metal oxide film so as to be able to maintain a current of a bottom cell and thereby keep a short-circuit current Jsc of a solar cell constant over a long period of time. A sputtering method is a method of forming a stack of a metal film and a metal oxide film, comprising the step 1 of forming a metal layer on a substrate, the step 2 of bringing a surface of the metal layer into contact with active oxygen, and the step 3 of forming a metal oxide film thereon after the step 2, wherein in the step 2 an amount of active oxygen at a first substrate position is different from that at a second substrate position.
REFERENCES:
patent: 4419533 (1983-12-01), Czubatyj
patent: 5620530 (1997-04-01), Nakayama
patent: 5998730 (1999-12-01), Shiozaki et al.
patent: 6140570 (2000-10-01), Kariya
patent: 6554973 (2003-04-01), Nakayama
patent: 20020134670 (2002-09-01), Echizen et al.
patent: 61-64874 (1986-04-01), None
patent: 2-1633363 (1990-06-01), None
patent: 6-116722 (1994-04-01), None
patent: 10-310862 (1998-11-01), None
patent: 3007758 (1999-11-01), None
Echizen Hiroshi
Nakayama Akiya
Takai Yasuyoshi
Canon Kabushiki Kaisha
Fitzpatrick ,Cella, Harper & Scinto
McDonald Rodney G.
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