Locking of mold compound to conductive substrate panels

Details Locking of mold compound to conductive substrate panels Locking of mold compound to conductive substrate panels

2005-11-08

2005-11-08

Picardat, Kevin M. (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

C257S683000, C257S723000, C257S731000

Reexamination Certificate

active

06963124

ABSTRACT:
A panel assembly of packaged integrated circuit devices including a conductive substrate panel having an array of device areas and a plurality of locking passageways. The locking passageways are positioned about an inactive buffer area which surrounds the periphery of the array of device areas. The panel assembly also includes a molded cap that is molded over the topside of the panel to encapsulate the array of device areas and the inactive buffer area. The molded cap includes conforming locking stem portions that extend into each of the locking passageways in a manner locking the molded cap to the substrate panel such that during singulation of the device areas, the molded cap will not separate from the substrate panel at the inactive buffer area. In another aspect of the invention, a method for producing the panel assembly having the locking passageways is described.

REFERENCES:
patent: 3658596 (1972-04-01), Osborne
patent: 5278445 (1994-01-01), Uemura et al.
patent: 5754408 (1998-05-01), Derouiche
patent: 6061243 (2000-05-01), Barnett et al.
patent: 6476478 (2002-11-01), Swiss et al.
patent: 6476885 (2002-11-01), Murray et al.
patent: 6483180 (2002-11-01), Bayan et al.
patent: 6576989 (2003-06-01), Hong et al.
patent: 6808961 (2004-10-01), Hong et al.
patent: 2001/0026255 (2001-10-01), Sano et al.
patent: 2002/0018172 (2002-02-01), Alwan

Affiliated with

Also associated with

Rating

Locking of mold compound to conductive substrate panels does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Locking of mold compound to conductive substrate panels, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Locking of mold compound to conductive substrate panels will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3468214