Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1992-02-13
1994-04-12
Hearn, Brian E.
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
156345, 118723R, 21912136, 31323131, 31511121, H01L 2100
Patent
active
053022378
ABSTRACT:
An apparatus and method for down-stream plasma processing (both etching and plasma enhanced deposition) are disclosed wherein only a portion of the surface area of a substrate is exposed to the low pressure, reactive gaseous processing environment. The remainder of the substrate remains outside a small enclosed processing area, thus leaving these areas unexposed to the processing agents and providing physical access for monitoring equipment or the like, for example when in-situ monitoring during processing is desired. Etch rates of up to 6 .mu.m/h have been obtained.
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patent: 3969813 (1976-07-01), Minetti et al.
patent: 4359360 (1982-11-01), Harris et al.
patent: 4931307 (1990-06-01), Sugita et al.
"Rapid, Nonmechanical Damage-Free Figuring of Optical Surfaces Using a Pla-Assisted Chemical Etching (PACE): Part I"; Zarowin et al.; Proc. SPIE; vol. 966; pp. 91-97; (1989).
"Rapid, Nonmechanical Damage-Free Figuring of Optical Surfaces Using Plasma-Assisted Chemical Etching (PACE)"; Bollinger et al.; Proc. SPIE; vol. 966; pp. 82-90 (1989).
"Localized Plasma Etching For Device Optimization"; Larson et al.; J. Vac. Sci.; vol. 10; No. 1; (Feb. 1992); pp. 27-29.
Larson Donald R.
Veasey David L.
Burdick Harold A.
Goudreau George
Hearn Brian E.
The United States of America as represented by the Secretary of
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