Localized biasing for silicon on insulator structures

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – On insulating substrate or layer

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C257SE21561

Reexamination Certificate

active

07659152

ABSTRACT:
A silicon-on-insulator device has a localized biasing structure formed in the insulator layer of the SOI. The localized biasing structure includes a patterned conductor that provides a biasing signal to distinct regions of the silicon layer of the SOI. The conductor is recessed into the insulator layer to provide a substantially planar interface with the silicon layer. The conductor is connected to a bias voltage source. In an embodiment, a plurality of conductor is provided that respectively connected to a plurality of voltage sources. Thus, different regions of the silicon layer are biased by different bias signals.

REFERENCES:
patent: 4035198 (1977-07-01), Dennard et al.
patent: 4612629 (1986-09-01), Harari
patent: 4679300 (1987-07-01), Chan et al.
patent: 4700454 (1987-10-01), Baerg et al.
patent: 4749660 (1988-06-01), Short et al.
patent: 4891329 (1990-01-01), Reisman et al.
patent: 5298449 (1994-03-01), Kikuchi
patent: 5374564 (1994-12-01), Bruel
patent: 5374581 (1994-12-01), Ichikawa et al.
patent: 5741733 (1998-04-01), Bertagnolli et al.
patent: 5770483 (1998-06-01), Kadosh et al.
patent: 5852310 (1998-12-01), Kadosh et al.
patent: 5855693 (1999-01-01), Murari et al.
patent: 5877070 (1999-03-01), Goesele et al.
patent: 5882987 (1999-03-01), Srikrishnan et al.
patent: 5894152 (1999-04-01), Jaso et al.
patent: 5945712 (1999-08-01), Kim
patent: 5953622 (1999-09-01), Lee et al.
patent: 5998808 (1999-12-01), Matsushita
patent: 6004406 (1999-12-01), Kobayashi et al.
patent: 6049110 (2000-04-01), Koh
patent: 6083324 (2000-07-01), Henley et al.
patent: 6150031 (2000-11-01), Yonehara
patent: 6245161 (2001-06-01), Henley et al.
patent: 6251754 (2001-06-01), Ohshima et al.
patent: 6291858 (2001-09-01), Ma et al.
patent: 6465331 (2002-10-01), Keeth et al.
patent: 2337851 (1999-12-01), None
Yang, I. Y., et al., “Silicon-on-insulator-with-active-substrate (SOIAS) technology”,1996 IEEE International SOI Conference, 1996. Proceedings., (1996), 106-107.
The American Heritage Dictionary of the English Language, Third Edition copyright 1992 by Houghton Miffin Company., Electronic Version Licensed from INSO Corporation.
“U.S. Appl. No. 10/230,938 Advisory Action mailed Jul. 13, 2004”, 3 pgs.
“U.S. Appl. No. 10/230,938 Advisory Action mailed Aug. 11, 2006”, 5 pgs.
“U.S. Appl. No. 10/230,938 Final Office Action May 3, 2006”, 17 pgs.
“U.S. Appl. No. 10/230,938 Final Office Action mailed Mar. 24, 2004”, 22 pgs.
“U.S. Appl. No. 10/230,938 Final Office Action mailed Apr. 6, 2005”, 20 pgs.
“U.S. Appl. No. 10/230,938 Non Final Office Action mailed Jul. 9, 2003”, 18 pgs.
“U.S. Appl. No. 10/230,938 Non Final Office Action mailed Sep. 6, 2006”, 22 pgs.
“U.S. Appl. No. 10/230,938 Non Final Office Action mailed Oct. 1, 2004”, 21 pgs.
“U.S. Appl. No. 10/230,938 Non Final Office Action mailed Nov. 4, 2005”, 24 pgs.
“U.S. Appl. No. 10/230,938 Notice of Allowance mailed Mar. 29, 2007”, 8 pgs.
“U.S. Appl. No. 10/230,938 Notice of Allowance mailed Aug. 22, 2007”, NOAR,5 pgs.
“U.S. Appl. No. 10/230,938 Response filed Jan. 3, 2005 to Non Final Office Action mailed Oct. 1, 2004”, 16 pgs.
“U.S. Appl. No. 10/230,938 Response filed Feb. 6, 2006 to Non Final Office Action mailed Nov. 4, 2005”, 19 pgs.
“U.S. Appl. No. 10/230,938 Response filed Jun. 22, 2004 to Final Office Action mailed Mar. 24, 2004”, 20 pgs.
“U.S. Appl. No. 10/230,938 Response filed Jul. 3, 2006 to Final Office Action May 3, 2006”, 16 pgs.
“U.S. Appl. No. 10/230,938 Response filed Oct. 5, 2005 to Final Office Action mailed Apr. 6, 2005”, 18 pgs.
“U.S. Appl. No. 10/230,938 Response filed Dec. 6, 2006 to Non Final Office Action mailed Sep. 6, 2006”, 18 pgs.
“U.S. Appl. No. 10/230,938 Response filed Dec. 9, 2003 to Non Final Office Action mailed Jul. 9, 2003”, 20 pgs.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Localized biasing for silicon on insulator structures does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Localized biasing for silicon on insulator structures, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Localized biasing for silicon on insulator structures will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-4228567

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.