Local oxidation of silicon (LOCOS) method employing graded...

Semiconductor device manufacturing: process – Formation of electrically isolated lateral semiconductive... – Recessed oxide by localized oxidation

Reexamination Certificate

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C438S444000, C438S791000

Reexamination Certificate

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06949448

ABSTRACT:
A method for forming a local oxidation of silicon (LOCOS) isolation region on a silicon substrate. A series of patterned graded oxidation mask layers formed of a material comprising silicon, oxygen and nitrogen is formed. The series of patterned graded oxidation mask layers has a comparatively high nitrogen:oxygen atomic ratio within a series of first contiguous sub-layers; a comparatively high nitrogen:oxygen atomic ratio within a series of third contiguous sub-layers; and a comparatively low nitrogen:oxygen atomic ratio within a series of second contiguous sub-layers.

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Stanley Wolf, “Silicon Processing for The VLSI Era”, vol. 2 : Process Integration, Lattice Press (Sunset Beach, CA), 1990, pp 33-35.

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