Local interconnect etch technique

Details Local interconnect etch technique Local interconnect etch technique

1989-01-22

1990-12-25

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156646, 156652, 156656, 156657, 156662, 1566591, 437200, H01L 21306, B44C 122, C23F 102, C03C 1500

Patent

active

049800205

ABSTRACT:
The disclosure relates to a method of forming a local interconnect by using a fluorine-based etchant with selectivity to cobalt and/or titanium silicide for removing unmasked portions of an electrically conductive interconnect pattern which is connected to a region of cobalt or titanium silicide.

REFERENCES:
patent: 4675073 (1987-06-01), Douglas
patent: 4713358 (1987-12-01), Bulat et al .
patent: 4793896 (1988-12-01), Douglas
patent: 4863559 (1989-09-01), Douglas

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