Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1986-11-12
1988-05-24
Powell, William A.
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
156662, 357 67, 357 71, 437 40, 437200, 437228, H01L 2348, H01L 2946, H01L 21306, B44C 122
Patent
active
047462191
ABSTRACT:
A local interconnect system for VLSI integrated circuits. After titanium is deposited for self-aligned silicidation of exposed moat and gate regions in a nitrogen atmosphere, a hardmask is deposited and patterned over the titanium. When a conductive titanium nitride layer is formed overall, it will already be patterned according to this hardmask.
REFERENCES:
patent: 4384301 (1983-05-01), Tasch et al.
patent: 4545116 (1985-10-01), Lau
patent: 4570328 (1986-02-01), Price et al.
Bell David A.
Haken Roger A.
Holloway Thomas C.
Tang Thomas E.
Wei Che-Chia
Anderson Rodney M.
Heiting Leo N.
Powell William A.
Sharp Melvin
Texas Instruments Incorporated
LandOfFree
Local interconnect does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Local interconnect, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Local interconnect will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1055668