Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1994-03-28
1995-05-02
Thompson, Gregory D.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
165 805, 16510426, 174 152, 257715, H05T 720
Patent
active
054125367
ABSTRACT:
Cooling module geometry provides a method for controlling local condensation for liquid impingement two-phase cooling of electrical and/or electronic circuit chips. The method and apparatus described herein uses vapor condensation in the exhaust flow from each chip site within a multi-chip module which utilizes direct liquid impingement with phase change.
REFERENCES:
patent: 4880053 (1989-11-01), Vladimir
patent: 4928207 (1990-05-01), Chrysler et al.
Anderson Timothy M.
Chrysler Gregory M.
Chu Richard C.
Simons Robert E.
Cutter Larry
International Business Machines - Corporation
Neff Lily
Thompson Gregory D.
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