Heat sink header assembly

Details Heat sink header assembly Heat sink header assembly

1995-05-23

1995-11-21

Thompson, Gregory D.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

165185, 257706, 257720, 361785, 439487, H05H 720

Patent

active

054693306

ABSTRACT:
In a header assembly, for interconnecting an electronic module to a mother board, including an insulating strip and at least one row of spaced-apart pins inserted through holes between an upper face and a lower face of the strip, each of the pins having an upper portion projecting from the upper face and being shaped and dimensioned to interconnect with the module, and a lower portion projecting from the lower face and being shaped and dimensioned to interconnect with the mother board, any adjacent two of the pins being separated by a length of the strip, the improvement which includes a plurality of collars of heat-dissipating material, one of the collars mounted around and in intimate contact with each of the pins, the collars having a peripheral outline shaped and dimensioned to avoid electrical contact with an adjacent pin.

REFERENCES:
patent: 3325766 (1967-06-01), Kolb et al.
patent: 3917375 (1975-11-01), Johnson
patent: 4082407 (1978-04-01), Smorzaniuk et al.

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