Load lock system for supercritical fluid cleaning

Details Load lock system for supercritical fluid cleaning Load lock system for supercritical fluid cleaning

2007-06-05

2007-06-05

Carrillo, Sharidan (Department: 1746)

Cleaning and liquid contact with solids

Processes

Including use of vacuum, suction, or inert atmosphere

C414S217000, C414S331010, C414S938000, C414S939000, C414S941000, C134S023000, C134S025100, C134S025400, C134S026000, C134S032000, C134S042000, C134S902000

Reexamination Certificate

active

10465906

ABSTRACT:
A substrate is transferred from an environment at about vacuum into a load lock through a first door. The substrate is then sealed within the load lock. The pressure within the load lock is raised to a high pressure above vacuum. A second door coupling the load lock to a high-pressure processing chamber is then opened and the substrate moved from the load lock into the high-pressure chamber. The substrate is then sealed within the high-pressure chamber. High-pressure processing, such as high pressure cleaning or high pressure deposition, is then performed on the substrate within the high-pressure chamber. Subsequently, the second door is opened and the substrate transferred into the load lock. The substrate is then sealed within the load lock. The pressure within the load lock is lowered to about vacuum and the first door opened. The substrate is then removed from the load lock into the environment.

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