Lithography using controlled polarization

Details Lithography using controlled polarization Lithography using controlled polarization

2006-08-01

2006-08-01

Kim, Peter B. (Department: 2851)

Photocopying

Projection printing and copying cameras

Illumination systems or details

C355S067000, C355S053000

Reexamination Certificate

active

07084960

ABSTRACT:
Lithography using controlled polarization. One aspect generates an electromagnetic radiation suitable for production of microelectronic devices, linearly polarizes at least a portion of the radiation at a pupil plane of a projection system to form linearly polarized radiation, and exposing a substrate using the linearly polarized radiation at a high exposure angle.

REFERENCES:
patent: 4302079 (1981-11-01), White
patent: 5673103 (1997-09-01), Inoue et al.
patent: 6324003 (2001-11-01), Martin
patent: 6404482 (2002-06-01), Shiraishi
patent: 2005/0225829 (2005-10-01), Schenker
Richard Schenker et al., “Material Limitations to 193-nm Lithographic System Lifetimes”, SPIE vol. 2726, pp. 698-706.
Richard E. Schenker et al., “Ultraviolet-induced densification in fused silica”, J. Appl. Phys. 82 (3), Aug. 1, 1997, pp. 1065-1071.
G. de Zwart et al., “Performance of a Step and Scan System for DUV Lithography”, SPIE vol. 3051, pp. 817-830.
Adam et al., “Polarization Effects in Immersion Lithography,” Proc. of SPIE, vol. 5377, pp. 329-342 (2004).

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