Lithography tool having a vacuum reticle library coupled to...

Photocopying – Projection printing and copying cameras – Detailed holder for original

Reexamination Certificate

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C700S246000, C700S250000, C700S257000, C355S132000, C414S217000

Reexamination Certificate

active

07057711

ABSTRACT:
A lithography tool includes an exposure chamber and a reticle handler that exchanges a reticle being exposed as prescribed by the user of the lithography tool. The reticle handler can include a vacuum-compatible robot, a vacuum chamber to house the robot, a load-lock to input reticles and transition them from atmospheric pressure to vacuum, a processing station for processing the reticle, and a reticle library for storing at least one extra reticle so that it is quickly available for exchange during an exposure process. The robot can have a two or more handed gripper to simultaneously hold multiple reticles. This allows a first reticle to be removed from the reticle stage with a first hand and a second reticle to be loaded onto the reticle stage with a second hand, and so on, which minimizes exchange time.

REFERENCES:
patent: 4536458 (1985-08-01), Ng
patent: 4563085 (1986-01-01), Ternes
patent: 4776745 (1988-10-01), Foley
patent: 6239863 (2001-05-01), Catey et al.
patent: 6404483 (2002-06-01), Segers et al.
patent: 2002/0071105 (2002-06-01), Miwa
patent: 2002/0102564 (2002-08-01), Mittmann et al.
patent: 2002/0167649 (2002-11-01), Heinle
patent: 2002/0188417 (2002-12-01), Levy et al.
patent: 2003/0211409 (2003-11-01), Nunes
patent: 2005/0057740 (2005-03-01), Del Puerto et al.
patent: 0 940 721 (1999-09-01), None
patent: 1052549 (2000-11-01), None
patent: 1052551 (2000-11-01), None
patent: 1211562 (2002-06-01), None
patent: 1318430 (2003-06-01), None
patent: WO 01/82055 (2001-11-01), None
Mishima et al., Description characteristics of isopropanor (IPA) and moisture frim IPA vapor dried silicon wafers, 1989, IEEE, pp. 121-129.
Siniaguine, Atmopheric down stream plasma etching of Si wafers, 1998, IEEE, pp. 139-145.
Jimbo et al., Thermal desorption behavior of absorbed materials on wafer surfaces, 1997, IEEE, pp. E-5 to E-8.
Sugiyama et al., Advanced electron-beam lithography—Software system AMDES 1980, IEEE, 531-539.
English-language Patent Abstract of JP 2000228354 A, published Aug. 15, 2000, 1 page.
Copy of European Search Report for Singapore Appln. 200303900-5 mailed Feb. 26, 2004.
Tkisue et al., Development of non-contact handling system for semiconductor wafers 1989, IEEE, pp. 121-129.
Park, S. et al., “Assessment of Potential Gains in Productivity Due to Proactive Reticle Management Using Discrete Event Simulation,”Proceedings of the 1999 Winter Simulation Conference, pp. 856-864 (1999).
European Search Report, from European Appl. No. 03017097.1, 4 pages, dated Aug. 3, 2005.
Abstract of JP-2000/228354, published Aug. 15, 2000.

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