Lithography projection objective, and a method for...

Optical: systems and elements – Lens – With field curvature shaping

Reexamination Certificate

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C355S053000, C430S270100

Reexamination Certificate

active

07463423

ABSTRACT:
A lithography projection objective for imaging a pattern to be arranged in an object plane of the projection objective onto a substrate to be arranged in an image plane of the projection objective comprises a multiplicity of optical elements that are arranged along an optical axis of the projection objective. The optical elements comprise a first group, following the object plane, of optical elements, and a last optical element, which follows the first group and is next to the image plane and which defines an exit surface of the projection objective and is arranged at a working distance from the image plane. The projection objective is tunable or tuned with respect to aberrations for the case that the volume between the last optical element and the image plane is filled by an immersion medium with a refractive index substantially greater than 1. The position of the last optical element is adjustable in the direction of the optical axis. A positioning device is provided that positions at least the last optical element during immersion operation such that aberrations induced by disturbance are at least partially compensated.

REFERENCES:
patent: 7209292 (2007-04-01), Epple et al.
patent: 7310187 (2007-12-01), Epple et al.
patent: 102 10 899 (2003-09-01), None
patent: 1 431 826 (2004-06-01), None
patent: 1 610 361 (2005-12-01), None
patent: WO 03/077036 (2002-05-01), None
patent: WO 2004/086470 (2004-10-01), None
patent: WO 2006/009573 (2006-01-01), None

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