Lithographic surface or thin layer modification

Details Lithographic surface or thin layer modification Lithographic surface or thin layer modification

1996-08-01

1999-07-20

Bueker, Richard

Etching a substrate: processes

Etching of semiconductor material to produce an article...

216 10, 216 11, 216 17, 216 41, 216 53, 216 56, 216 92, 438748, H01L 2100

Patent

active

059252596

ABSTRACT:
A process for producing lithographic features in a substrate layer is is described, comprising the steps of lowering a stamp (15) carrying an reactant (14) onto a substrate (10), confining the subsequent reaction to the desired pattern, lifting said stamp and removing the debris of the reaction from the substrate. Preferably, the stamp carries the pattern to be etched or depressions corresponding to such a pattern. Using the described methods, patterns with submicron features can be generated. The method allows a general solution to parallel handling and transfer of materials in a variety of technical fields.

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patent: 3716911 (1973-02-01), Burtscher et al.
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patent: 5512131 (1996-04-01), Kumar et al.
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patent: 5772905 (1998-06-01), Chou
Kumar et al., "Features of gold having micrometer to centimeter dimensions can be formed through a combination of stamping with an elastomeric stamp and an alkanethiol "ink" followed by chemical etching", pp. 2002-2004, Appl. Phys. Lett. 63 (1993).
J. L. Wilbur et al., "Lithographic Molding: A Convenient Route to Structures with Sub-Micrometer Dimensions", Advanced Materials, (1995), 7, No. 7, pp. 649-652.

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