Lithographic process for device fabrication using a multilayer m

Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Making electrical device

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430 5, 430396, 430 30, 356124, 3561245, 356389, 356445, 356239, G01N 2188, G03F 700

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ABSTRACT:
A lithographic process for semiconductor device fabrication is disclosed. In the process a patterned mask having a multilayer film formed on a substrate is illuminated by extreme ultraviolet (EUV) radiation and the radiation reflected from the pattern mask is directed onto a layer of energy sensitive material formed on a substrate. The image of the pattern on the mask is thus introduced into the energy sensitive material. The image is then developed and transferred into the underlying substrate. The multilayer film is inspected for defects by applying a layer of energy-sensitive film (called the inspection film) in proximity to the multilayer film and exposing the energy-sensitive material to EUV radiation. The thickness of the multilayer film is such that a portion of the EUV radiation is transmitted through the inspection film, reflected from the multilayer film and back into the inspection film. The exposed inspection film is then developed, and the developed inspection film is inspected to determine if it indicates the presence of defects in the underlying multilayer film.

REFERENCES:
patent: 5162867 (1992-11-01), Kohno
patent: 5710067 (1998-01-01), Foote et al.
patent: 5795684 (1998-08-01), Troccolo
"Imaging of EUV Lithographic Masks with Programmed Substrate Defects", by Kguyen, K. et al., OSA Proceedings on Extreme Utraviolet Lithography, vol. 23, pp. 193-203 (1994).
Lin et al., J. Vac. Sci. Technol. B, Minimum Critical Defects in Extreme-Ultravoilet Lithography Masks, vol. 15, pp. 2467-2470, Nov./Dec. 1997.

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