Lithographic process

Details Lithographic process Lithographic process

2011-03-22

2011-03-22

Chea, Thorl (Department: 1721)

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Including heating

C430S270100, C430S296000, C430S311000

Reexamination Certificate

active

07910292

ABSTRACT:
The present invention provides a lithographic process for producing high aspect ratio parts from an epoxy-type negative photoresist comprising the steps of: (i) irradiating a prebaked masked epoxy-type negative photoresist on a substrate with light at a total energy density of from 18,000 to 35,000 mJ/cm2, (ii) post-baking the exposed photoresist at elevated temperature, and (iii) developing the exposed photoresist in a solvent, wherein no more than 15% of the energy density is contributed by light having a wavelength of 400 nm or less. The invention also discloses a reciprocating microengine (10) comprising a cylinder (14), piston (12) and crankshaft made by the process.

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Zhong-Geng Ling; Kun Lian; Linke Jian, “Improved patterning quality of SU-8 microstructures by optimizing the exposure parameters,” Proc. of Spie; Advances in Resist Technology and Processing XVII, p. 1019-1027.
Conradie E H et al., “SU-8 thick photoresist processing as a functional material for MEMS applications,” journal, Journal of Micromechanics & Microengineering (New York, NY), vol. 12 ( No. 4), p. 368-374.

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