Lithographic printing with polarized light

Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Making electrical device

Reexamination Certificate

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Details

C430S005000, C430S322000, C359S490020, C359S483010, C359S494010, C359S558000, C355S067000, C355S071000

Reexamination Certificate

active

07090964

ABSTRACT:
The present invention provides systems and methods for improved lithographic printing with polarized light. In embodiments of the present invention, polarized light (radially or tangentially polarized) is used to illuminate a phase-shift mask (PSM) and produce an exposure beam. A negative photoresist layer is then exposed by light in the exposure beam. A chromeless PSM can be used. In further embodiments of the present invention, radially polarized light is used to illuminate a mask and produce an exposure beam. A positive photoresist layer is then exposed by light in the exposure beam. The mask can be an attenuating PSM or binary mask. A very high image quality is obtained even when printing contact holes at various pitches in low k applications.

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Office Action for Korean Patent Application No. 10-2004-7016864, mailed Mar. 22, 2006, 2 pages.
English translation of the Examiner's Ground for Rejection for Korean Patent Application No. 10-2004-7016864, 1 page.

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