Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1986-10-28
1987-11-17
Powell, William A.
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
156644, 156646, 156648, 156657, 1566591, 1566611, 156662, 156653, 427 431, 428137, 430 5, 430313, H01L 21306, B44C 122, C03C 1500, C03C 2506
Patent
active
047072180
ABSTRACT:
Disclosed is a process for reducing lithographic image size for integrated circuit manufacture. A mask of photosensitive material having an opening of a minimum size dictated by the limits of lithography is formed on a substrate. Reduction in the image size is achieved by establishing sidewalls to the interior vertical surfaces of the opening by depositing a conformal layer, followed by anisotropic etching. The dimension of the opening is reduced by the combined thickness of the two opposite insulator sidewalls.
In a specific direct application of the disclosed process, a photomask/stencil having a pattern of openings of a minimum size smaller than possible by lithography, per se, is formed.
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Giammarco Nicholas J.
Gimpelson Alexander
Kaplita George A.
Lopata Alexander D.
Scaduto Anthony F.
Coca T. Rao
International Business Machines - Corporation
Powell William A.
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