Lithographic apparatus, method of exposing a substrate,...

Optics: measuring and testing – Dimension – Thickness

Reexamination Certificate

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Reexamination Certificate

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07835017

ABSTRACT:
A method of exposing a substrate (e.g. in a lithographic apparatus comprising a substrate table to support a substrate) according to one embodiment of the invention includes performing first and a second height measurement of a part of at least one substrate with a first and second sensor, generating and storing an offset error map based on a difference between the measurements; generating and storing a height map of portions of the substrate (or another substrate that has had a similar processing as the part) by performing height measurements with the first sensor and correcting this height map by means of the offset error map; and exposing the substrate (or the other substrate).

REFERENCES:
patent: 2002/0018207 (2002-02-01), Ina et al.
patent: 2002/0158185 (2002-10-01), Nelson et al.
patent: 2003/0218141 (2003-11-01), Queens et al.
patent: 1 061 561 (2000-12-01), None
patent: 1 253 471 (2002-10-01), None
patent: 63-024116 (1988-02-01), None
patent: 2001-143991 (2001-05-01), None
patent: 2001-345250 (2001-12-01), None
patent: 2003-031493 (2003-01-01), None
International Search Report issued in International Application No. PCT/NL2004/000900 dated Jan. 4, 2005.
Chinese Office Action for Appln. No. 200480041713.7 dated Jun. 13, 2008.
English translation of Japanese Official Action issued on Jun. 18, 2009 in Japanese Application No. 2006-546870.

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