Lithographic apparatus and device manufacturing method

Details Lithographic apparatus and device manufacturing method Lithographic apparatus and device manufacturing method

2008-12-19

2010-10-05

Mathews, Alan A (Department: 2882)

Photocopying

Projection printing and copying cameras

Step and repeat

C355S030000, C355S072000, C355S077000

Reexamination Certificate

active

07808614

ABSTRACT:
An immersion lithographic projection apparatus has a liquid confinement structure configured to at least partly confine liquid to a space between a projection system and a substrate, the confinement structure having a buffer surface, when in use, positioned in close proximity to a plane substantially comprising the upper surface of the substrate and of a substrate table holding the substrate, to define a passage having a flow resistance. A recess is provided in the buffer surface, the recess, when in use, being normally full of immersion liquid to enable rapid filling of a gap between the substrate and substrate table as the gap moves under the buffer surface. The recess may be annular or radial and a plurality of recesses may be provided.

REFERENCES:
patent: 3573975 (1971-04-01), Dhaka et al.
patent: 3648587 (1972-03-01), Stevens
patent: 4346164 (1982-08-01), Tabarelli et al.
patent: 4390273 (1983-06-01), Loebach et al.
patent: 4396705 (1983-08-01), Akeyama et al.
patent: 4480910 (1984-11-01), Takanashi et al.
patent: 4509852 (1985-04-01), Tabarelli et al.
patent: 5040020 (1991-08-01), Rauschenbach et al.
patent: 5610683 (1997-03-01), Takahashi
patent: 5715039 (1998-02-01), Fukuda et al.
patent: 5825043 (1998-10-01), Suwa
patent: 5900354 (1999-05-01), Batchelder
patent: 6191429 (2001-02-01), Suwa
patent: 6236634 (2001-05-01), Lee et al.
patent: 6560032 (2003-05-01), Hatano
patent: 6600547 (2003-07-01), Watson et al.
patent: 6603130 (2003-08-01), Bisschops et al.
patent: 6633365 (2003-10-01), Suenaga
patent: 6954256 (2005-10-01), Flagello et al.
patent: 7394521 (2008-07-01), Van Santen et al.
patent: 7397532 (2008-07-01), Novak
patent: 2002/0020821 (2002-02-01), Van Santen et al.
patent: 2002/0163629 (2002-11-01), Switkes et al.
patent: 2003/0123040 (2003-07-01), Almogy
patent: 2003/0169407 (2003-09-01), Hasegawa et al.
patent: 2003/0174408 (2003-09-01), Rostalski et al.
patent: 2004/0000627 (2004-01-01), Schuster
patent: 2004/0021844 (2004-02-01), Suenaga
patent: 2004/0075895 (2004-04-01), Lin
patent: 2004/0109237 (2004-06-01), Epple et al.
patent: 2004/0114117 (2004-06-01), Bleeker
patent: 2004/0119954 (2004-06-01), Kawashima et al.
patent: 2004/0125351 (2004-07-01), Krautschik
patent: 2004/0135099 (2004-07-01), Simon et al.
patent: 2004/0136494 (2004-07-01), Lof et al.
patent: 2004/0160582 (2004-08-01), Lof et al.
patent: 2004/0165159 (2004-08-01), Lof et al.
patent: 2004/0207824 (2004-10-01), Lof et al.
patent: 2004/0211920 (2004-10-01), Derksen et al.
patent: 2004/0263809 (2004-12-01), Nakano
patent: 2005/0110973 (2005-05-01), Streefkerk et al.
patent: 2005/0132914 (2005-06-01), Mulkens et al.
patent: 2005/0219488 (2005-10-01), Nei et al.
patent: 2005/0259234 (2005-11-01), Hirukawa et al.
patent: 2005/0286032 (2005-12-01), Lof et al.
patent: 2006/0038968 (2006-02-01), Kemper et al.
patent: 2006/0152697 (2006-07-01), Poon et al.
patent: 206 607 (1984-02-01), None
patent: 221 563 (1985-04-01), None
patent: 224448 (1985-07-01), None
patent: 242880 (1987-02-01), None
patent: 0023231 (1981-02-01), None
patent: 0418427 (1991-03-01), None
patent: 1039511 (2000-09-01), None
patent: 1 571 695 (2005-09-01), None
patent: 2474708 (1981-07-01), None
patent: 58-202448 (1983-11-01), None
patent: 62-065326 (1987-03-01), None
patent: 62-121417 (1987-06-01), None
patent: 63-157419 (1988-06-01), None
patent: 04-305915 (1992-10-01), None
patent: 04-305917 (1992-10-01), None
patent: 06-124873 (1994-05-01), None
patent: 07-132262 (1995-05-01), None
patent: 07-220990 (1995-08-01), None
patent: 10-228661 (1998-08-01), None
patent: 10-255319 (1998-09-01), None
patent: 10-303114 (1998-11-01), None
patent: 10-340846 (1998-12-01), None
patent: 11-176727 (1999-07-01), None
patent: 2000-058436 (2000-02-01), None
patent: 2001-091849 (2001-04-01), None
patent: 2004-165666 (2004-06-01), None
patent: 2004-193252 (2004-07-01), None
patent: WO 99/49504 (1999-09-01), None
patent: WO 03/077036 (2003-09-01), None
patent: WO 03/077037 (2003-09-01), None
patent: WO 2004/019128 (2004-03-01), None
patent: WO 2004/053596 (2004-06-01), None
patent: WO 2004/053950 (2004-06-01), None
patent: WO 2004/053951 (2004-06-01), None
patent: WO 2004/053952 (2004-06-01), None
patent: WO 2004/053953 (2004-06-01), None
patent: WO 2004/053954 (2004-06-01), None
patent: WO 2004/053955 (2004-06-01), None
patent: WO 2004/053956 (2004-06-01), None
patent: WO 2004/053957 (2004-06-01), None
patent: WO 2004/053958 (2004-06-01), None
patent: WO 2004/053959 (2004-06-01), None
patent: WO 2004/055803 (2004-07-01), None
patent: WO 2004/057589 (2004-07-01), None
patent: WO 2004/057590 (2004-07-01), None
patent: WO 2005/024517 (2005-03-01), None
English Translation of WO 2004/053955 A1 (dated Jun. 24, 2004).
M. Switkes et al., “Immersion Lithography at 157 nm”, MIT Lincoln Lab, Orlando 2001-1, Dec. 17, 2001.
M. Switkes et al., “Immersion Lithography at 157 nm”, J. Vac. Sci. Technol. B., vol. 19, No. 6, Nov./Dec. 2001, pp. 2353-2356.
M. Switkes et al., “Immersion Lithography: Optics for the 50 nm Node”, 157 Anvers-1, Sep. 4, 2002.
B.J. Lin, “Drivers, Prospects and Challenges for Immersion Lithography”, TSMC, Inc., Sep. 2002.
B.J. Lin, “Proximity Printing Through Liquid”, IBM Technical Disclosure Bulletin, vol. 20, No. 11B, Apr. 1978, p. 4997.
B.J. Lin, “The Paths to Subhalf-Micrometer Optical Lithography”, SPIE vol. 922, Optical/Laser Microlithography (1988), pp. 256-269.
G.W.W. Stevens, “Reduction of Waste Resulting from Mask Defects”, Solid State Technology, Aug. 1978, vol. 21 008, pp. 68-72.
S. Owa et al., “Immersion Lithography; its potential performance and issues”, SPIE Microlithography 2003, 5040-186, Feb. 27, 2003.
S. Owa et al., “Advantage and Feasibility of Immersion Lithography”, Proc. SPIE 5040 (2003).
Nikon Precision Europe GmbH, “Investor Relations—Nikon's Real Solutions”, May 15, 2003.
H. Kawata et al., “Optical Projection Lithography using Lenses with Numerical Apertures Greater than Unity”, Microelectronic Engineering 9 (1989), pp. 31-36.
J.A. Hoffnagle et al., “Liquid Immersion Deep-Ultraviolet Interferometric Lithography”, J. Vac. Sci. Technol. B., vol. 17, No. 6, Nov./Dec. 1999, pp. 3306-3309.
B.W. Smith et al., “Immersion Optical Lithography at 193nm”, Future Fab International, vol. 15, Jul. 11, 2003.
H. Kawata et al., “Fabrication of 0.2μm Fine Patterns Using Optical Projection Lithography with an Oil Immersion Lens”, Jpn. J. Appl. Phys. vol. 31 (1992), pp. 4174-4177.
G. Owen et al., “1/8μm Optical Lithography”, J. Vac. Sci. Technol. B., vol. 10, No. 6, Nov./Dec. 1992, pp. 3032-3036.
H. Hogan, “New Semiconductor Lithography Makes a Splash”, Photonics Spectra, Photonics TechnologyWorld, Oct. 2003 Edition, pp. 1-3.
S. Owa and N. Nagasaka, “Potential Performance and Feasibility of Immersion Lithography”, NGL Workshop 2003, Jul. 10, 2003, Slide Nos. 1-33.
S. Owa et al., “Update on 193nm immersion exposure tool”, Litho Forum, International SEMATECH, Los Angeles, Jan. 27-29, 2004, Slide Nos. 1-51.
H. Hata, “The Development of Immersion Exposure Tools”, Litho Forum, International SEMATECH, Los Angeles, Jan. 27-29, 2004, Slide Nos. 1-22.
T. Matsuyama et al., “Nikon Projection Lens Update”, SPIE Microlithography 2004, 5377-65, Mar. 2004.
“Depth-of-Focus Enhancement Using High Refractive Index Layer on the Imaging Layer”, IBM Technical Disclosure Bulletin, vol. 27, No. 11, Apr. 1985, p. 6521.
A. Suzuki, “Lithography Advances on Multiple Fronts”, EEdesign, EE Times, Jan. 5, 2004.
B. Lin, Thek3coefficient in nonparaxial λ/NA scaling equations for resolution, depth of focus, and immersion lithography,J. Microlith., Microfab., Microsyst.1(1):7-12 (2002).
English Translation of WO 2004/053955, dated Jun. 24, 2004.
English Translation of JP 2005-101488, dated Apr. 14, 2005.
Reissue U.S. Appl. No. 10/367,910 of U

Affiliated with

Also associated with

Rating

Lithographic apparatus and device manufacturing method does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Lithographic apparatus and device manufacturing method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Lithographic apparatus and device manufacturing method will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4223892