Lithographic apparatus and device manufacturing method

Details Lithographic apparatus and device manufacturing method Lithographic apparatus and device manufacturing method

2007-09-04

2007-09-04

Kim, Robert (Department: 2881)

Radiant energy

Irradiation of objects or material

Irradiation of semiconductor devices

C250S492210, C250S492220, C250S492300, C250S50400H, C250S370080, C250S370090, C250S372000, C378S034000

Reexamination Certificate

active

10813682

ABSTRACT:
A lithographic apparatus includes a radiation source configured to provide radiation to an illumination system, the radiation source configured to provide radiation in a first wavelength range and in a second wavelength range, the second wavelength range being different from the first wavelength range. A support is configured to support a patterning device, the patterning device is configured to impart the radiation with a pattern in its cross-section. A substrate table is configured to hold a substrate, and a projection system is configured to project the patterned radiation onto a target portion of a substrate. The first wavelength range is the primary wavelength of the lithographic apparatus. The second wavelength range is used for setup of the lithographic apparatus, the setup including one or more of calibration, qualification, performance test, and alignment. The second wavelength range may also be used for exposure of a further substrate.

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