Coating processes – Direct application of electrical – magnetic – wave – or... – Plasma
Patent
1995-06-07
1997-08-12
King, Roy V.
Coating processes
Direct application of electrical, magnetic, wave, or...
Plasma
427573, 427569, 427250, 4272551, 4272552, 427124, 4271261, 427314, B05D 306, C23C 1600
Patent
active
056563388
ABSTRACT:
Chemical vapor deposition of titanium metal is accomplished by forming a liquid solution of titanium tetrabromide in bromine, vaporizing the solution and contacting the vapor mixture with a plasma in the vicinity of a substrate. These titanium films show good conformality, low electrical resistance and are suitable as contact and adhesion layers in semiconductor microelectronics. By mixing ammonia gas with the mixed vapors of titanium tetrabromide and bromine, films containing titanium nitride are deposited at about 400.degree. C. These titanium nitride films are suitable as diffusion barriers and adhesion layers in semiconductor devices.
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