Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate
2007-05-15
2007-05-15
Jackson, Jerome (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
C257S687000, C257S712000, C257SE23097, C257SE23098, C361S699000
Reexamination Certificate
active
10607782
ABSTRACT:
In a process of making a container barrier upon a heat spreader, the heat spreader is augmented with a cold-formed o-ring, and thereafter, it is bonded to a die. A liquid solder is filled into the space created by the o-ring. The thermal interface material can also have one of several footprints to facilitate heat transfer.
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patent: 6448637 (2002-09-01), Studebaker
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patent: 63096945 (1988-04-01), None
Jackson Jerome
Schwegman Lundberg Woessner & Kluth P.A.
Warren Matthew E.
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