Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1975-04-04
1977-10-04
Yudkoff, Norman
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
29576E, 148171, 148172, 156624, 252 623GA, 427 87, B01J 1704, H01L 21208
Patent
active
040522520
ABSTRACT:
A thin layer of semiconductor material with an extremely smooth surface can be grown on a substrate by liquid phase epitaxy. When the growing solution contacts the surface of the substrate, the substrate is at a lower temperature than the solution. The temperature difference should be less than 1.degree. C and depends upon the desired degree of smoothness. Both the substrate and the solution are then cooled to permit deposition of the layer.
REFERENCES:
patent: 3783825 (1974-01-01), Kobayasi et al.
patent: 3897281 (1975-07-01), Gilbert et al.
patent: 3909317 (1975-09-01), Itoh et al.
patent: 3925117 (1975-12-01), Stone et al.
IBM Technical Disclosure Bulletin, vol. 13, No. 11, p. 3221, Apr. 1971.
Ettenberg Michael
Lockwood Harry Francis
Bruestle Glenn H.
Calder D. N.
Hollander Barry I.
RCA Corporation
Yudkoff Norman
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