Liquid phase epitaxial growth with interfacial temperature diffe

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step

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29576E, 148171, 148172, 156624, 252 623GA, 427 87, B01J 1704, H01L 21208

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active

040522520

ABSTRACT:
A thin layer of semiconductor material with an extremely smooth surface can be grown on a substrate by liquid phase epitaxy. When the growing solution contacts the surface of the substrate, the substrate is at a lower temperature than the solution. The temperature difference should be less than 1.degree. C and depends upon the desired degree of smoothness. Both the substrate and the solution are then cooled to permit deposition of the layer.

REFERENCES:
patent: 3783825 (1974-01-01), Kobayasi et al.
patent: 3897281 (1975-07-01), Gilbert et al.
patent: 3909317 (1975-09-01), Itoh et al.
patent: 3925117 (1975-12-01), Stone et al.
IBM Technical Disclosure Bulletin, vol. 13, No. 11, p. 3221, Apr. 1971.

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