Liquid metal matrix thermal paste

Alloys or metallic compositions – Gallium – indium – or thallium base

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252387, C22C 2800

Patent

active

051981890

ABSTRACT:
A liquid metal matrix thermal paste comprises a dispersion of non-reacting thermally conductive particles in a low melting temperature liquid metal matrix. The particles preferably are silicon, molybdenum, tungsten or other materials which do not react with gallium at temperatures below approximately 100.degree. C. The preferred liquid metals are gallium and indium eutectic, gallium and tin eutectic and gallium, indium and tin ternary eutectic. The particles may be coated with a noble metal to minimize surface oxidation and enhance wettability of the particles. The liquid metal matrix thermal paste is used as a high thermally conducting paste in cooling high power dissipation components in conjunction with a conventional fluid cooling system.

REFERENCES:
patent: 3150901 (1964-09-01), Esten et al.
patent: 3169859 (1965-02-01), Treaftis et al.
patent: 3175893 (1965-03-01), Meretsky et al.
patent: 3209450 (1965-10-01), Klein et al.
patent: 3839780 (1974-10-01), Freedman et al.
patent: 4092697 (1976-05-01), Spaight
patent: 4233103 (1980-11-01), Shaheen
patent: 4239534 (1980-12-01), Taketoshi
patent: 4323914 (1982-04-01), Berndlmaier et al.
patent: 4398975 (1983-08-01), Ohsawa et al.
patent: 4659384 (1987-04-01), Daigo et al.
patent: 5012858 (1991-05-01), Natori et al.
patent: 5024264 (1991-06-01), Natori et al.
patent: 5053195 (1991-10-01), MacKay
patent: 5056706 (1991-10-01), Dolbear et al.
Patent Abstracts of Japan, vol. 12, No. 342 (E-658), Sep. 14th, 1988; JP-A-63 102 345 (Fujitsu Ltd) May 7, 1988.
Patent Abstracts of Japan, vol. 8, No. 236 (C-249), Oct. 30th, 1984; and JP-A-59 116 357 (Hitachi Seisakusho K.K.) Jul. 5, 1984.
Patent Abstracts of Japan, vol. 7, No. 218 (E-200), Sep. 28th, 1983; and JP-A-58 111 354 (Hitachi Seisakusho K.K.) Jul. 2, 1983.
Patent Abstracts of Japan, vol. 11, No. 3 (C-395), Jan. 7th, 1987; and JP-A-61 179 844 (Tokuriki Honten Co., Ltd) Aug. 12, 1986.

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