Liquid metal contact microrelay

Details Liquid metal contact microrelay Liquid metal contact microrelay

2005-11-08

2005-11-08

Enad, Elvin G. (Department: 2832)

Electricity: circuit makers and breakers

Liquid contact

C200S193000

Reexamination Certificate

active

06963038

ABSTRACT:
Liquid metal microrelays may be made where a contact is formed by constraining a quantity of liquid metal at the end of a contact support suspended over a substrate. Movement of the contact support typically drags the liquid metal along the surface of the substrate and allows the liquid metal to bridge contacts located on the substrate. Coplanar waveguides may be used for the switched signal instead of microstrip transmission lines to reduce transmission line discontinuities due to impedance changes.

REFERENCES:
patent: 4652710 (1987-03-01), Karnowsky et al.
patent: 6506989 (2003-01-01), Wang
patent: 6671078 (2003-12-01), Flanders et al.
patent: 6774325 (2004-08-01), Wong et al.
patent: 6781074 (2004-08-01), Fong et al.
patent: 6787719 (2004-09-01), Wong

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