Liquid light-sensitive resinous composition

Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Radiation sensitive composition or product or process of making

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430281, 522101, G03C 1727

Patent

active

049487000

ABSTRACT:
A liquid heat- and light-sensitive resinous composition which contains as main components (A) a photopolymerizable compound prepared by reacting a novolak type epoxy compound with successively, an unsaturated monocarboxylic acid represented by at least one of formula (I) and (II) and a saturated or unsaturated polybasic acid anhydride, (B) a photopolymerizable compound having at least one ethylenic unsaturated double bond, (C) an epoxy compound having at least one epoxy group, (D) a photopolymerization initiator, (E) a thermosetting catalysts capable of making an epoxy group undergo a thermal reaction, and (F) an organic solvent; ##STR1## wherein R represents -H or -CH.sub.3 ; R.sup.1, R.sup.2 and R.sup.3 each represents an unsubstituted or substituted alkylene group, an unsubstituted or substituted arylene group, or an unsubstituted or substituted aralkylene group; and X represents -COO-, -OCO- or -O-.
The composition exhibits photo- and thermocurability, developability with an alkaline aqueous solution and ability to form a permanent protective mask for printed circuit boards.

REFERENCES:
patent: 4398013 (1983-08-01), Johnson

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