Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate
2007-10-23
2007-10-23
Clark, Jasmine (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
C257S713000, C257S714000, C257S717000, C257S718000, C257SE33075, C257SE23083, C257SE23040, C257SE23095, C257SE23097, C361S676000, C361S677000, C361S688000, C361S689000
Reexamination Certificate
active
11540391
ABSTRACT:
In one embodiment, a liquid immersion cooled multichip module is provided which includes a substrate having chips mounted thereon and which is adapted to mount with a printed circuit board. A lid is adapted to secure to the printed circuit board so as to mount with the substrate to form a fluid chamber between the lid and the substrate, and to cause the substrate to mate with the printed circuit board. In one embodiment, a cambered bolster plate is located on a side of the printed circuit board opposite the lid and the lid is fastened to the bolster plate to secure the lid to the printed circuit board. A baffle, which may be removable in some embodiments, is located within the lid and directs coolant flow through the fluid chamber.
REFERENCES:
patent: 5514906 (1996-05-01), Love et al.
patent: 5859763 (1999-01-01), Nam et al.
patent: 5901040 (1999-05-01), Cromwell et al.
patent: 6052284 (2000-04-01), Suga et al.
patent: 6223815 (2001-05-01), Shibasaki
patent: 6404640 (2002-06-01), Ishimine et al.
patent: 6621707 (2003-09-01), Ishimine et al.
patent: 6729383 (2004-05-01), Cannell et al.
patent: 6882156 (2005-04-01), Hauptman
patent: 7133286 (2006-11-01), Schmidt et al.
patent: 2005/0248921 (2005-11-01), Schmidt et al.
patent: 2006/0002086 (2006-01-01), Teneketges et al.
patent: 0453675 (1990-04-01), None
A.C.Pfahnl, et al., Heat Sinks Reactively Soldered to ICs, DesignCon East 2004, Apr. 5, 2004, published at http://www.mtfoil.com/technology/tech.html.
Cepeda-Rizo Juan
Esmailpour Mohsen
Teneketges Nicholas J.
Balzan Intellectual Property Law, PC
Balzan, Esq. Christopher R.
Clark Jasmine
Teradyne, Inc.
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