Liquid-filled balloons for immersion lithography

Semiconductor device manufacturing: process – Radiation or energy treatment modifying properties of...

Reexamination Certificate

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C430S322000, C378S034000, C355S076000, C438S947000

Reexamination Certificate

active

07026259

ABSTRACT:
A liquid-filled balloon may be positioned between a workpiece, such as a semiconductor structure covered with a photoresist, and a lithography light source. The balloon includes a thin membrane that exhibits good optical and physical properties. Liquid contained in the balloon also exhibits good optical properties, including a refractive index higher than that of air. Light from the lithography light source passes through a mask, through a top layer of the balloon membrane, through the contained liquid, through a bottom layer of the balloon membrane, and onto the workpiece where it alters portions of the photoresist. As the liquid has a low absorption and a higher refractive index than air, the liquid-filled balloon system enhances resolution. Thus, the balloon provides optical benefits of liquid immersion without the complications of maintaining a liquid between (and in contact with) a lithographic light source mechanism and workpiece.

REFERENCES:
patent: 5900354 (1999-05-01), Batchelder
patent: 2002/0101655 (2002-08-01), Greenwald et al.
patent: 2002/0163629 (2002-11-01), Switkes et al.
patent: 2005/0036183 (2005-02-01), Yeo et al.
patent: 2005/0037269 (2005-02-01), Levinson
patent: WO 04/093159 (2004-10-01), None
M. Switkes et al., “Immersion Lithography: Optics for the 50 nm Node”(Lincoln Lab presentation), Sep. 4, 2002.
M. LaPedus',news summary for Silicon Strategies, “ASML, Canon, Nikon take dip into immersion litho”, Feb. 27, 2003.
M. LaPedus',news summary for Silicon Strategies, “University shows feasibility of immersion lithography”, Feb. 27, 2003.
M. LaPedus',news summary for Silicon Strategies, “TSMC pursues immersion lithography for IC production”, Apr. 22, 2003.
GEEK.com, article by Sander Olsen “Immersion lithography could be a godsend to chipmakers”(plus attached email comments), Apr. 22, 2003.

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