Liquid etching reactor and method

Details Liquid etching reactor and method Liquid etching reactor and method

1983-06-27

1984-11-13

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156642, 156656, 1566591, 156666, 156901, 156345, C23F 100, B44C 122, C03C 1500, C03C 2506

Patent

active

044824254

ABSTRACT:
Reactor and method for removing a material such as copper from a substrate such as a printed circuit board, utilizing a liquid etchant. The work to be etched is placed in a narrow channel, and the etchant is pumped rapidly across the surface of the work at a rate such that the composition of the etchant does not change significantly from one side of the work to the other.

REFERENCES:
patent: 3751313 (1973-08-01), DiBenedetto et al.
patent: 4376009 (1983-03-01), Kunz

Affiliated with

Also associated with

Rating

Liquid etching reactor and method does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Liquid etching reactor and method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Liquid etching reactor and method will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2359744