Liquid encapsulated ball grid array semiconductor device with fi

Details Liquid encapsulated ball grid array semiconductor device with fi Liquid encapsulated ball grid array semiconductor device with fi

1994-05-26

1995-11-21

Crane, Sara W.

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Wire contact, lead, or bond

257700, 257701, 257702, 257704, 257738, 257780, 257787, H01L 2302, H01L 2312, H01L 2348

Patent

active

054689996

ABSTRACT:
A ball grid array semiconductor device (10) includes a package substrate (14 or 16) having a plurality of conductive traces (18), bond posts (20), and conductive vias (22). A semiconductor die (12) is mounted to the package substrate. Orthogonal wire bonds (28) are used to electrically connect staggered bond pads (26) to corresponding bond posts (20) on the substrate. A liquid encapsulant (40) is used to cover the die, the wire bonds, and portions of the package substrate. In another embodiment, a package substrate (50) includes a lower bonding tier (52) and an upper bonding tier (54). Wire bonds (60) are used to electrically connect an outer row of bond pads (64) to bond posts (20) of lower tier (52), while wire bonds (62) are used to electrically connect an inner row of bond pads (64) to bond posts (20) of an upper tier (54). The loop height of wire bonds (60) is smaller than that of wire bonds (62).

REFERENCES:
patent: 4618879 (1986-10-01), Mizukoshi et al.
patent: 4643935 (1987-02-01), McNeal et al.
patent: 4975765 (1990-12-01), Ackermann et al.
patent: 5091772 (1994-02-01), Kohara et al.
patent: 5091825 (1992-02-01), Hill et al.
patent: 5107325 (1992-04-01), Nakayoshi
patent: 5111989 (1992-05-01), Holdgrafer et al.
patent: 5216278 (1993-06-01), Lin et al.
patent: 5359227 (1994-10-01), Liang et al.

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