Liquid dispense manifold for chemical-mechanical polisher

Details Liquid dispense manifold for chemical-mechanical polisher Liquid dispense manifold for chemical-mechanical polisher

2005-05-24

2005-05-24

Shakeri, Hadi (Department: 3723)

Abrading

Machine

Endless band tool

C451S060000, C451S446000, C222S420000, C222S568000, C239S550000

Reexamination Certificate

active

06896600

ABSTRACT:
A liquid dispense manifold having drip nozzles configured to form controlled droplets is provided for use in chemical-mechanical polisher (CMP) systems. The liquid dispense manifold includes a plurality of drip nozzles that are secured to the side of the liquid dispense manifold. Each of the plurality of drip nozzles has a passage defined between a first end and a second end. A bend is defined within the drip nozzle passage such that droplets are directed downward toward a polishing surface. The nozzles are configured with respect to the manifold to provide an even flow rate of substantially uniform drops onto the polishing surface.

REFERENCES:
patent: 2428276 (1947-09-01), Griswold
patent: 2594735 (1952-04-01), Crumley
patent: 4702689 (1987-10-01), Schmidt et al.
patent: 5868608 (1999-02-01), Allman et al.
patent: 6116991 (2000-09-01), Liu et al.
patent: 6622335 (2003-09-01), Anderson et al.

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