Liquid crystal display driver integrated circuit package

Details Liquid crystal display driver integrated circuit package Liquid crystal display driver integrated circuit package

2006-02-21

2006-02-21

Tran, Mai-Huong (Department: 2818)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C345S050000, C345S055000, C345S087000, C345S092000, C345S204000, C345S206000, C361S749000, C361S750000

Reexamination Certificate

active

07002809

ABSTRACT:
Disclosed is an LCD driver integrated circuit package and a chip on glass type LCD device using the package. The LCD driver integrated circuit package includes a mold that has signal output bumps and signal input bumps formed thereon, wherein the signal output bumps and the signal input bumps have different surface areas that contact the mold and an adjacent conductive film. Due to the different contact surface areas, different amounts of pressure are applied to different parts on the conductive film when a force is applied to the mold. One or more bump pressure control patterns are formed on the mold compensate for the difference in pressure caused by this difference between the total contact areas. Accordingly, the LCD driver integrated circuit package can be mounted on a chip on glass type LCD panel without causing device failure.

REFERENCES:
patent: 6664942 (2003-12-01), Kim et al.

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