Patent
1985-05-07
1987-02-17
Corbin, John K.
350339R, G02F 113
Patent
active
046435263
ABSTRACT:
An IC chip is connected to terminal portions of conductive films on a lower substrate of a liquid crystal display panel by face down bonding. The IC chip and conductive films are coated with resin to protect the IC chip and films.
REFERENCES:
patent: 4025162 (1977-05-01), Yagi
patent: 4058970 (1977-11-01), Ichinose
patent: 4145120 (1979-03-01), Kubota
patent: 4394067 (1983-07-01), Spruijt et al.
patent: 4474432 (1984-10-01), Takamatsu et al.
Ando Naotake
Hirohara Toshihide
Iinuma Yoshio
Matsunaga Masaaki
Tajima Eiichi
Citizen Watch Co. Ltd.
Corbin John K.
Gallivan Richard F.
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