Liquid crystal display device and method for manufacturing...

Liquid crystal cells – elements and systems – Particular structure – Having significant detail of cell structure only

Reexamination Certificate

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C349S152000, C349S143000, C349S043000, C349S042000, C349S149000, C438S627000, C438S643000, C438S609000, C438S608000, C438S678000, C438S030000, C257S072000, C257S059000

Reexamination Certificate

active

06774969

ABSTRACT:

BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a liquid crystal display device and a method for manufacturing the same, and more particularly to a liquid crystal display device in which pads of a liquid crystal display panel and/or wirings connected to the pads are protected from being corroded when the pads are connected to an external driver integrated circuit, and a method for manufacturing the liquid crystal display device.
2. Description of Related Art
In these days, electronic display devices are more widely used as information transmission media and various types of electronic display devices are used for industrial apparatus or home appliances. Such electronic display devices have been developed to have appropriate functions for various demands of the information era.
In general, electronic display devices display various information so that users can utilize such information. That is, the electronic display devices convert electric information signals outputted from electronic apparatus into light information signals recognized by the users through their eyes.
The types of electronic display devices include an emissive display device type and a non-emissive display device type. An emissive display device displays light information signals by using light emission, and a non-emissive display device displays light information signals by using reflection, scattering or interference of light. The emissive display device includes a cathode ray tube (CRT), a plasma display panel (PDP), a light emitting diode (LED) and an electroluminescent display (ELD). The emissive display device is called an active display device. Also, the non-emissive display device, called a passive display device, includes a liquid crystal display (LCD), an electrochemical display (ECD) and an electrophoretic image display (EPID).
The CRT has been used for a television or a monitor of a computer as a display device for a long time since it has a high quality and a low manufacturing cost. The CRT, however, has some disadvantages such as a heavy weight, a large volume and high power consumption.
Recently, the demand for a new electronic display device is greatly increased such as a flat panel display device having excellent characteristics of thin thickness, light weight, low driving voltage and low power consumption. Such flat panel display devices can be manufactured owing to the rapidly improved semiconductor technology.
Of the flat panel devices, the liquid crystal display (LCD) devices have been widely utilized for various electronic devices because an LCD device is thin and has low power consumption and high display quality almost same as that of a CRT. Also, the LCD devices can operate with a low driving voltage and can be easily manufactured so that the LCD devices are widely used for various electronic apparatuses.
The LCD devices are generally divided into a transmission type LCD device, a reflection type LCD device, and a reflection-transmission type LCD device. The transmission type LCD device displays information by using an external light source and the reflection type LCD device displays information by using natural light. The reflection-transmission type LCD device operates in a transmission mode for displaying an image using a built-in light source of the display device in a room or in a dark place where an external light source does not exist, and operates in a reflection mode for displaying the image by reflecting external incident light in the area having high illumination.
FIG. 1
is a schematic perspective view showing an LCD panel of a conventional liquid crystal display device,
FIG. 2
is a plan view showing a conventional LCD panel and integrated circuits connected to the LCD panel for driving the LCD panel, and
FIG. 3
is a cross-sectional view showing a thin film transistor and a pad region of the conventional LCD panel.
Referring to
FIGS. 1 and 2
, a liquid crystal device has an LCD panel
130
for displaying an image and driver integrated circuits
137
and
138
for generating image signals.
The LCD panel
130
includes a first substrate
100
, a second substrate
102
located opposite to the first substrate
100
, and liquid crystal
114
injected between the first substrate
100
and the second substrate
102
.
A plurality of gate and data lines
104
and
106
are formed on the first substrate
100
in a matrix shape, and pixel electrodes
108
and thin film transistors (TFT) are formed at intersections of the gate lines
104
and the data lines
106
. A color filter
112
and a transparent common electrode
110
are formed on the second substrate
102
. The color filter
112
includes red. green. blue (R. G. B) pixels displaying predetermined colors while light passes through the pixels. Also, polarizing plates (not shown) are formed on the outsides of the first and the second substrates
100
and
102
for maintaining a direction of the light transmitting thereof according to an orientation of the liquid crystal
114
.
Referring to
FIG. 3
, a thin film transistor
109
has a gate electrode
15
formed on the first substrate
100
, a gate insulation layer
25
formed on the gate electrode
15
and the first substrate
100
, an active pattern
30
formed on the gate insulation layer
25
where the gate electrode
15
is positioned, an ohmic contact layer pattern
35
formed on the active pattern
30
, and source and drain electrodes
40
and
45
formed on the ohmic contact pattern
35
. A passivation layer
50
is formed on the first substrate
100
on which the thin film transistor
109
is formed. The passivation layer
50
is comprised of an inorganic material or an organic material. A contact hole
80
is formed through the passivation layer
50
to expose the drain electrode
45
. Also, contact holes (not shown) are formed through the passivation layer
50
to expose gate terminals and drain terminals in a pad region.
The gate electrode
15
is connected to the gate line
104
, and the source electrode
40
is connected to the data line
106
. The drain electrode
45
is connected to the pixel electrode
108
. Thus, when a scanning voltage is applied to the gate electrode
15
through the gate line
104
, a signal voltage passing the data line
106
is applied from the source electrode
40
to the drain electrode
45
through the active pattern
30
. When the signal voltage is applied to the drain electrode
45
, a potential difference is generated between a common electrode
110
of the second substrate
102
and the pixel electrode
108
connected to the drain electrode
45
. Then, the molecular arrangement of the liquid crystal
114
injected between the pixel electrode
108
and the common electrode
110
is changed, so light transmissivity of the liquid crystal
114
is varied. Thus, the thin film transistor
109
serves as a switching device for operating pixels of the LCD panel
130
.
In addition, first pads
133
and second pads
134
are formed on the LCD panel
130
as shown in FIG.
2
. The first pads
133
are prolonged from the gate line
104
and the second pads
134
are prolonged from the data line
106
. The first pads
133
are connected to a first integrated circuit
137
generating the scanning voltage, and the second pads
134
are connected to a second integrated circuit
138
generating the signal voltage. Hence, the scanning voltage generated from the first integrated circuit
137
is applied to the gate line
104
through the first pads
133
, and the signal voltage generated from the second integrated circuit
138
is applied to the data line
106
through the second pads
134
. Various methods can be utilized for connecting the first pads
133
to the first integrated circuit
137
or connecting the second pads
134
to the second integrated circuit
138
. Typically, bumps for having connection with the pads are formed on electrodes of the integrated circuit, and then the pads are connected to the integrated circuit using the bumps.
In general, a tape automated bonding (TAB) method is used for

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