Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices
Patent
1998-03-02
2000-02-15
Saadat, Mahshid
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
For plural devices
257678, 257 81, 257 99, 257 89, H01L 2334, H01L 2715, H01L 2302
Patent
active
060256443
DESCRIPTION:
BRIEF SUMMARY
TECHNICAL FIELD
The present invention relates to a liquid crystal display device for displaying visible information by controlling the orientation of a liquid crystal, and also to various apparatus using such a liquid crystal display device.
BACKGROUND ART
In recent years, a liquid crystal display device is used to display visible information in a wide variety of applications such as a navigation system, television, palm-top computer, electronic personal organizer, portable telephone, etc. In the production of liquid crystal display devices, one known technique to mount a semiconductor device such as a driver integrated circuit on a liquid crystal panel is to directly mount the semiconductor device on one of a pair substrates facing each other via a liquid crystal. This technique is called the COG (chip on glass) technique. It is expected that the COG technique will contribute to further reductions in the size and weight of liquid crystal display devices and also to an improvement in the connection pitch.
In conventional COG type liquid crystal display devices, a plurality of input connection terminals are formed on a substrate, and input bump electrodes of a liquid crystal driver IC are directly connected to the input connection terminals using a connection element such as an ACF (anisotropic conductive film). Furthermore, output connection terminals of an apparatus using a liquid crystal display, such as a portable telephone, are formed on an FPC (flexible printed circuit), and the FPC is connected to the input connection terminals. The connection between the FPC and the input connection terminals is generally made using an ACF.
In the conventional COG type liquid crystal display device, since the FPC is connected to the input connection terminals using the ACF, a thermo-compression bonding process is necessary to make the connection. However, the thermo-compression bonding process can cause a residual stress, which in turn causes the liquid crystal panel or the liquid crystal driver IC to receive a force arising from the residual stress. Heat generated during the thermo-compression bonding process can cause the ACF connecting the liquid crystal drive IC to the substrate to become soft, which in turn causes a trouble associated with the contact between the liquid crystal driver IC and the substrate. Although the problem associated with the connection of the liquid crystal driver IC may be avoided by performing the thermo-compression bonding process at a temperature lower than the softening temperature of the ACF connecting the liquid crystal driver IC to the liquid crystal panel, the reduction in the thermo-compression temperature can cause another problem associated with the reduction in the bonding strength.
DISCLOSURE OF INVENTION
In view of the problems in the conventional COG-type liquid crystal display device, it is an object of the present invention to provide a technique of producing a high-reliability liquid crystal display device with a high production yield without using a thermo-compression bonding process thereby preventing a liquid crystal driver IC from being destroyed and from being separated from a substrate. It is another object of the present invention to provide a technique of producing a liquid crystal display device or an apparatus using a liquid crystal display device by means of a simple assembling process.
To achieve the above objects, the invention provides a liquid crystal display device comprising: a pair of substrates facing each other via a liquid crystal; at least a semiconductor device directly connected to one substrate; and a plurality of semiconductor input terminals formed on the substrate so that signals may be applied to the semiconductor device via the semiconductor input terminals, the semiconductor input terminals being connected to semiconductor driving output terminals formed on an apparatus using the liquid crystal display device, wherein the semiconductor input terminals and the semiconductor driving output terminals are connected to each other via an e
Clark Jhihan B
Saadat Mahshid
Seiko Epson Corporation
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