Liquid cooling system for LSI packages

Details Liquid cooling system for LSI packages Liquid cooling system for LSI packages

1993-11-22

1996-06-04

Hille, Rolf

Heat exchange

Structural installation

165 804, 16510433, 361699, 257714, 622592, 62216, F04B 1704, B60H 100

Patent

active

055224520

ABSTRACT:
In a liquid cooling system for a printed circuit board on which integrated circuit packages are mounted, heat sinks are secured respectively to the packages in heat transfer contact therewith. Nozzles are provided in positions corresponding to the heat sinks. A housing is tightly sealed to the printed circuit board to enclose the packages, heat sinks and nozzles in a cooling chamber. A feed pump pressurizes working liquid cooled by a heat exchanger and supplies the pressurized liquid to the nozzles for ejecting liquid droplets to the heat sinks. A liquid suction pump is connected to an outlet of the housing for draining liquid coolant to the heat exchanger and a vapor suction pump is connected to a second outlet of the housing for sucking vaporized coolant to the heat exchanger. The cooling chamber is maintained at a sub-atmospheric pressure to promote nucleate boiling of the working fluid.

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