Liquid coating system

Details Liquid coating system Liquid coating system

1993-11-01

1994-12-20

Jones, W. Gary

Coating apparatus

With means to centrifuge work

118 56, 118321, 118694, 118696, 118698, 118697, 118320, 134153, 134902, 239214, 239222, 239224, 239379, B05C 500

Patent

active

053743121

ABSTRACT:
A liquid coating system according to the present invention comprises, a liquid supply source, a nozzle having an inlet communicating with the liquid supply source and a substantially linear liquid discharge portion, a pressure feed unit for feeding the liquid under pressure from the liquid supply source to the nozzle by means of compressed gas, a spin chuck for fixedly supporting a semiconductor wafer, an up-and-down cylinder for causing the liquid discharge portion of the nozzle to closely face the wafer on the spin chuck, and a rotating mechanism for rotating the spin chuck. The nozzle includes a liquid reservoir, in which the liquid supplied from the liquid supply source is collected, and a large number of small passages communicating with the liquid reservoir. The liquid coating system further comprises an air operation valve disposed in a communication passage between the inlet of the nozzle and the liquid supply source and used to reduce the pressure of the liquid fed under pressure to the liquid reservoir.

REFERENCES:
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patent: 4326553 (1982-04-01), Hall
patent: 4774109 (1988-09-01), Hadximihalis et al.
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patent: 5002008 (1991-03-01), Ushijima et al.
patent: 5010840 (1991-04-01), Busker et al.
patent: 5089305 (1992-02-01), Ushijima et al.
patent: 5094884 (1992-03-01), Hillman et al.
patent: 5127362 (1992-07-01), Iwatsu et al.
patent: 5134962 (1992-08-01), Amada et al.

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