Liquid chemical process for forming conductive through-holes thr

Details Liquid chemical process for forming conductive through-holes thr Liquid chemical process for forming conductive through-holes thr

1983-12-05

1985-02-26

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

29853, 29882, 156150, 156630, 156634, 156645, 156652, 156656, 156668, 156902, 204 24, C23F 102, B44C 122, C03C 1500, B29C 1708

Patent

active

045016380

ABSTRACT:
A conductive through-hole hole is formed by liquid chemically etching a hole completely through a dielectric sandwiched between conductors and by deforming at least one conductor which has been undercut during the etching.

REFERENCES:
patent: 3557446 (1971-01-01), Charschan
patent: 3969815 (1976-07-01), Hacke et al.
patent: 4184909 (1980-01-01), Chang et al.
patent: 4289573 (1981-09-01), Economy et al.
patent: 4319708 (1982-03-01), Lomerson
J. W. Coburn, "Plasma Etching", 6 pages.
CPI No. H-82-8750-N, Prior Art Search Report, D. J. Pinto, pp. 3-8.

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