Liquid based substrate method and structure for layer...

Details Liquid based substrate method and structure for layer... Liquid based substrate method and structure for layer...

2011-03-22

2011-03-22

Ghyka, Alexander G (Department: 2812)

Semiconductor device manufacturing: process

Bonding of plural semiconductor substrates

Subsequent separation into plural bodies

C438S459000, C257SE21568

Reexamination Certificate

active

07910456

ABSTRACT:
An embodiment of a composite substrate member in accordance with the present invention has a handle substrate member derived from a plurality of nanoparticles in a fluid mixture, and a thickness of material transferred to the handle substrate member. The handle substrate member may be formed from a plurality of liquid layers, for example a thinner surface layer conveying specific properties to the donor/substrate interface, and a thicker support layer dispensed over the surface layer.

REFERENCES:
patent: 7351644 (2008-04-01), Henley
patent: 7670930 (2010-03-01), Tauzin et al.
patent: 2003/0203547 (2003-10-01), Sakaguchi et al.
B.N. Mukashev et al.,Hydrogen Implantation into Silicon: Infra-Red Absorption Spectra and Electrical Properties, Institute of High Energy Physics, Academy of Sciences of the Kazakh SSR, Alma-Ata1; 91, 509 (1985).

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