Liquid agitation and purification system

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step

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Details

156642, 156662, 156345, H01L 21306, B44C 122

Patent

active

052829235

ABSTRACT:
A plurality of semiconductor wafers are vertically loaded into a cassette, the cassette is placed on a support structure, the cassette and support structure are placed in a drop-in tank, and the drop-in tank is placed inside a larger tank containing etching solution. A plurality of holes in the drop-in tank allow the etching solution in the larger tank to enter and fill the drop-in tank. A pump sucks etching solution out of the larger tank and as a result, also sucks etching solution out of the drop-in tank through the plurality of holes. The pumped out solution is then filtered of residue waste resulting from the etching process, and the filtered solution is pumped into a hollow portion of the support structure and from thence, out of the hollow portion through a plurality of holes formed on a top surface of the support structure, generating thereby, currents of filtered etching solution. The currents of filtered etching solution then flow into an open bottom of the cassette, flow past the vertically hanging plurality of semiconductor wafers, and flow out of an open top of the cassette, carrying along with them, the residue waste resulting from the etching process.
The residue waste then sinks to the bottom of the drop-in tank and is subsequently sucked out by the pump, along with the etching solution, through the plurality of holes in the drop-in tank. The pumped out solution is then filtered and recirculated back into the drop-in tank through the support structure as previously described.

REFERENCES:
patent: 3863333 (1975-02-01), Loya
patent: 4501636 (1985-02-01), Valley
patent: 4554046 (1985-11-01), Taguchi et al.
patent: 4980017 (1990-12-01), Kaji et al.

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