Linear chemical mechanical polishing apparatus equipped with...

Details Linear chemical mechanical polishing apparatus equipped with... Linear chemical mechanical polishing apparatus equipped with...

2005-01-04

2005-01-04

Hail, Joseph J. (Department: 3723)

Abrading

Precision device or process - or with condition responsive...

With indicating

C451S005000, C451S041000, C451S285000, C451S286000, C451S287000, C451S288000, C451S289000, C451S296000, C451S299000, C451S303000, C451S307000, C451S311000

Reexamination Certificate

active

06837774

ABSTRACT:
A linear chemical mechanical polishing apparatus that is equipped with a programmable pneumatic support platen and a method for controlling the polishing profile on a wafer surface during a linear CMP process are disclosed. The programmable pneumatic support platen is positioned juxtaposed to a bottom surface of a continuous belt for the linear CMP apparatus and positioned corresponding to a position of the wafer carrier so as to force the polishing pad against the wafer surface to be polished. The support platen has a predetermined thickness, a plurality of apertures through the thickness and a plurality of openings in a top surface in fluid communication with a gas source through the plurality of apertures.

REFERENCES:
patent: 5916012 (1999-06-01), Pant et al.
patent: 6261958 (2001-07-01), Crevasse et al.

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