Etching a substrate: processes – Etching and coating occur in the same processing chamber
Reexamination Certificate
2007-01-10
2009-02-17
Ahmed, Shamim (Department: 1792)
Etching a substrate: processes
Etching and coating occur in the same processing chamber
C216S041000, C438S694000, C438S723000
Reexamination Certificate
active
07491343
ABSTRACT:
A method for etching features in an etch layer is provided. A patterned photoresist mask is provided over the etch layer, the photoresist mask having at least one photoresist line having a pair of sidewalls ending at a line end is provided. A polymer layer is placed over the at least one photoresist line, wherein a thickness of the polymer layer at the line end of the photoresist line is greater than a thickness of the polymer layer on the sidewalls of the photoresist line. Features are etched into the etch layer through the photoresist mask, wherein a line end shortening (LES) ratio is less than or equal to 1.
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Adams Yoko Yamaguchi
Kota Gowri
Lin Frank Y.
Zhong Qinghua
Ahmed Shamim
Beyer Law Group LLP
Lam Research Corporation
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