Limp-stream method for selectively etching integral cathode subs

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step

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156345, 156642, 156656, C23F 102

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active

043760090

ABSTRACT:
In a method for preparing an integral cathode substrate and support in which selected surface portions of a formed metal part are masked, the unmasked surface portions etched, and then the mask removed, the improvement wherein the etching step is conducted by alternately directing a solid limp stream of liquid etchant into and out of contact with the part while permitting the liquid etchant to drain away from the part by gravity.

REFERENCES:
patent: 2905539 (1959-09-01), Bowerman
patent: 3432900 (1969-03-01), Kerstetter
patent: 3510372 (1970-05-01), Hoornstra
patent: 3861981 (1975-01-01), Loo
patent: 3986911 (1976-10-01), Lerner
patent: 4021279 (1977-05-01), Hirs
RCA Technical Notes, TN No. 1159, mailed Jul. 23, 1976, One-Piece Bimetal Cathode Cup and Sleeve by J. C. Turnbull.
U.S. Patent Application Serial No. 210,246 filed Nov. 25, 1980 by W. R. Poff et al., currently pending.

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