Lightwave packaging for pairs of optical devices having thermal

Details Lightwave packaging for pairs of optical devices having thermal Lightwave packaging for pairs of optical devices having thermal

1993-01-07

1994-01-18

James, Andrew J.

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With provision for cooling the housing or its contents

257718, 257719, 257433, 257723, 361679, 361707, 361714, H01L 2302, G02B 630, H02B 100, H05K 720

Patent

active

052801918

ABSTRACT:
An optical package particularly suited for use with a pair of optical devices is disclosed. In a preferred embodiment, the package may house an optical transmitting device and an optical receiving device such that the package forms a transceiver. The package advantageously utilizes a number of molded plastic piece parts to reduce the package cost and simplify construction. By utilizing molded components, optical alignment within the package is automatically achieved.

REFERENCES:
patent: 4792878 (1988-12-01), Buselmeier et al.
patent: 5043775 (1991-08-01), Lee
patent: 5047835 (1991-09-01), Chang
patent: 5052005 (1991-09-01), Tanaka et al.

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